高级精细完成过程的研讨会报告下载

抽象的：

The technology is really spice of life. This seminar is all about latest technology which is useful for finishing materials with very high precision. These are the latest processes are called as Advanced Fine Finishing Processes. In this seminar we are going to take a overlook on some of these processes.

随着从微型仪表范围到纳米米范围的零件的严格技术和功能要求的需求，超压缩整理过程的演变显然是制造科学家和工程师的需求。该类别的传统饰面过程具有各种局限性，例如复杂的形状，尺寸和3-D零件不能在经济和迅速地处理和完成。这导致了先进的精加工技术的发展，例如磨料流加工，磁性磨料饰面，磁性浮动抛光，磁性磨性磨料饰面和离子束加工。在除离子光束加工以外的所有这些过程中，工件的磨损以受控的方式进行，使工件中的穿透深度是一小部分千分尺，因此最终的终点接近纳米范围。

The working principles and the applications of these processes are discussed in this paper along with some recent research going on in these areas.

本文介绍了一些高级精细的I加工过程，例如磨料流加工（AFM），磁性磨料流加工（MAFM），磁性磨料饰面（MAP），磁性浮动抛光（MFP），Magneto Rhelogical rogical rogical ropical rasasivil rasasivil rasasive饰面（MRAF），弹性发射加工（EEM）和离子光束加工（IBM）。

MAGNETORHEOLOGICAL FINISHING (MRF)

精密透镜通常由脆弱的母亲ials such as glass, and they tend to crack during machining I finishing. Even a single microscopic crack can drastically hinder a lens’s performance and make it to fail in performing its intended function. Manufacture of a lens usually involves two operations – grinding and finishing. Grinding operation makes a lens close to the desired size while finishing removes the cracks and surface imperfections either created by grinding or could not be removed during grinding. Manual grinding and polishing are non-deterministic and a high local pressure may lead to subsurface damage. To take care of these difficulties, Magnetorheological-finishing (MRF) process has been developed which is automatic in nature.

磁性浮动抛光（MFP）

此过程是为了轻柔地完成非常硬的材料（例如陶瓷）而开发的，这些材料在磨削过程中会产生缺陷，从而导致疲劳失败。为了达到低水平的受控力，磁场用于在修饰陶瓷产品（如陶瓷球和轴承辊）中支撑磨牙浆。这个过程称为磁浮标

抛光（MFP）。MFP技术基于磁性流体的铁磁行为，该磁液可以悬浮在磁场中悬浮在其中的非磁性流体和磨料。施加在磨料上的悬浮力与场梯度成正比，非常小且高度可控。这是一种具有平坦和球形形状的脆性材料超级精加工的好方法

ION BEAM MACHINING (IBM)

纳米技术是超压缩加工的目标，具有产生1NM或更少阶的表面饰面的能力，这意味着接近最终的表面饰面。离子光束加工是基于通过轰炸1至10 keV的能量离子和1磨机的电流密度轰击1磨机/CM2的分子制造（或原子尺寸去除库存）工艺。该过程可以应用于制造仪表和机械设备的超细精度部分。溅射基本上是通过动量从入射离子转移到靶原子的动量转移的工件表面原子的现象。当实际传递的实际能量超过5-10 eV的通常结合能时，将发生从工作表面中去除原子。

Ions of higher energy may transfer enough momentum such that more than one. atom causes a cascading effect in the layer near the surface, removing several atoms. Ions of still higher energy may get implanted deep within the material after ejecting out

几个原子或分子。但是，不需要轰炸太多的高能量离子，以免对工件表面造成任何损害。

ELASTIC EMISSION MACHINING

这个过程从工件中删除材料urface to atomic level by mechanical methods, and gives completely mirrored, crystallographically and physically undisturbed finished surface. It can give surface of the order of atomic dimensions (~ 0.2 nm to 0.4 nm) [17-20]. Using ultrafine particles to collide with the workpiece surface, it may be possible to finish the surface by the atomic scale elastic fracture without plastic deformation [19,20], and the process is known as Elastic Emission Machining (EEM). Fig.shows working principle of EEM through the schematic diagram. The polyurethane ball used during EEM is of about 56 mm diameter. This ball is mounted on a shaft whose axis of rotation is inclined at about 45° to the vertical axis, and it is driven by a variable speed motor. The workpiece is immersed in the slurry of zrO2 or A12O3 (size 20 nm to 20 ìm) abrasives and water as carrier. The slurry is circulated in the gap by a diaphragm pump, and maintained at constant temperature with a heat exchanger. The proposed mechanism of material removal due to slurry and work interaction involves erosion of the surface atom by the bombardment of abrasive particles without the introduction of dislocation.

结论

The importance of ultrafine finishing processes using abrasive as cutting tool, and their capabilities to achieve nanometer order surface finish is discussed. Working principle of seven such advanced finishing processes, viz. AFM, MAFM, MAP, MFP, MRAM, EEM

and IBM have been explained in brief. It has been observed that the precise control of forces on abrasive particles using non-traditional methods discussed in this paper, proved useful in performing ultra precision finishing. Fine finishing of brittle materials like ceramics, glasses, and semiconductor wafers can be easily done in nanometer range. The exact mechanics of abrasive interaction with the workpiece surface in most of these processes is still subject of in-depth research, and need involvement of multidisciplinary sciences.